Chemical Mechanical Polishing

Chemical Mechanical Polishing

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The PSS AccuSizer is recognized as the most accurate and sensitive system for detecting large particle counts (LPC) in CMP slurries. While laser diffraction can measure the mean size of the distribution well, the single particle optical sizing (SPOS) technique in the AccuSizer is hundreds of times for sensitive to tails/LPC.

Download the application note on sensitivity to tails

Chemical Mechanical Polishing

The most popular system for this application is the Point of Use online system. Click the AccuSizer image for more details.AccuSizer POU Image

Available with no dilution, or autodilution if required

Three sensor options - optimized for your slurry

Up to 512 size channels

Statistical accuracy - 300,000 counts/min

Built in touch PC

ROI in months, not years

Read the sections below for additional information on these applications.

Ceria CMP Slurry Monitoring

Ceria CMP Slurry Monitoring The AccuSizer is the Best Tool to Measure Particle Size and Concentration in Ceria CMP Slurry Monitoring Cerium oxide (ceria) based slurries are becoming more widely used in a variety of chemical mechanical planarization (CMP) applications for integrated circuit (IC) manufacture. A short study proved how the PSS AccuSizer FX Mini…

CMP Filter Monitoring

It is critical to monitor and control the health of the CMP slurry being used in the polishing process. The AccuSizer Point of Use (POU) particle size and concentration analyzer has been successfully used to optimize filtration operations at several points in the distribution system. The AccuSizer POU systems can be placed close to the…

CMP Filter Test

CMP Filter Test in CMP slurries In an effort to reduce the number of oversized particles in CMP slurries, filter testing has been performed. The image shows the Accusizer FX results for a CMP slurry before and after it has been passed through a 1 micron filter. The Accusizer FX uses focused extinction wherein the…


Over-sized or agglomerated particles (>1micron) can wreak havoc on polished semiconductor wafers by creating microscratches